Regarding the mobile phone connection technology, we look at several integration scenarios: one is the baseband integrated wireless connection chip, and the other is the integration between the wireless chips. We believe that the latter is now more able to meet the needs of the market. The evolution of wireless connectivity technology also places demands on the core competitiveness of wireless connectivity chip vendors.
Baseband integrated wireless connection chip is not practical
GPS is integrated into the baseband chip. At present, only one company in the world has achieved this, but its GPS receiving performance is not as good as the independent GPS solution. We understand that most of the high-end GPS phones of Nokia, Samsung and Sony Ericsson use independent chips to realize GPS functions. And even if the GPS baseband is integrated into the cellular baseband, the handset requires a separate GPS RF module.
Bluetooth is integrated into the baseband chip. Today's Bluetooth chip size is very small, the price is very cheap, the integration is also very high, it is already a single chip. Some companies have integrated the Bluetooth baseband into the cellular baseband chip, but they also need a separate Bluetooth RF chip, which is not as good as a stand-alone Bluetooth SoC (system-on-a-chip). Moreover, a big application in the future is that the mobile phone is equipped with both Wi-Fi and Bluetooth, and it is necessary to solve the problem of coexistence interference between the two. Once Bluetooth is integrated into the baseband, coexistence interference with Wi-Fi is difficult to handle. The combination of Wi-Fi and Bluetooth is more in line with the law of industrial development and the real needs of the market. Moreover, the development of Bluetooth technology is extremely rapid, the protocol stack is becoming more and more abundant, and the version has been developed from 2.0 to 2.1, and then to 3.0. Therefore, the firmware of the Bluetooth chip needs to be continuously upgraded to meet the evolving market demand, which is closely related to the generation of baseband chips. The two- to three-year-old mature and stable development rhythm obviously does not match.
Wi-Fi is integrated into the baseband chip. Wi-Fi requires a certain amount of on-chip RAM (random access memory) and ROM (read only memory) resources due to its high operating rate (10 Mbps or more). A separate ARM CPU is required to implement its protocol function. MAC (Media Access Control) The hardware design of the layer must be in place. In addition, since the 802.11n standard has not yet been finalized, the protocol stack and firmware may need to be continuously upgraded. Wi-Fi has its own unique protocol and power-saving mode, and the RF working range is similar to that of 3G baseband chips. Therefore, if a manufacturer's Wi-Fi chip is unknowingly integrated into the baseband without large-scale commercial verification, the risk is relatively large. Therefore, only after the Wi-Fi market has developed relatively mature and stable, it is more rational for manufacturers to consider integration with cellular baseband.
Wireless connection chip integration solution to meet current market demand
Since mobile phone manufacturers need to provide different wireless connectivity functions for different market segments and user needs, multiple independent wireless connection chips + wireless connection Combo (combination) chips are the best solution to meet this real market demand and have sufficient flexibility. . In general, there are the following wireless connection chip working scenarios:
Independent Bluetooth chip. The independent Bluetooth chip is suitable for most of the low-end FeaturePhone (function phone) market today. The development trend of this type of Bluetooth chip is that the price is constantly lower and the function is getting stronger.
Independent GPS chip. The independent GPS chip is suitable for high-end smartphones with GPS positioning.
Independent FM chip. Since the price of FM chips has dropped very sharply, and Bluetooth and FM have almost become standard, this market is difficult to survive independently. At present, independent FM chips have to give way to Bluetooth+FM chips.
Independent Wi-Fi chip. Independent Wi-Fi is suitable for users who only need Wi-Fi application scenarios, but today Bluetooth is almost standard on mobile phones. Once Wi-Fi is needed, it is difficult to avoid Wi-Fi/Bluetooth combination chips. Independent Wi-Fi is suitable for special applications such as printers, digital photo frames, etc.
Bluetooth + FM combination chip. The combined chip application is more popular.
Bluetooth + Wi-Fi (+FM) combination chip. In applications where Wi-Fi is required, Bluetooth is almost the standard, so Bluetooth + Wi-Fi (+FM) is the best choice. Due to the relatively low price and technical threshold of FM, integrated FM is also a good choice. After all, the impact on cost and chip size is very important because it works in 2.4GHz ISM (industrial, scientific, medical frequency band). The problem is to solve the coexistence interference between Wi-Fi and Bluetooth.
Bluetooth + GPS + (FM) combination chip. The market is gradually heating up.
Broadcom currently offers corresponding products in all of the above categories.
Bluetooth + Wi-Fi + GPS (+ FM) combination chip. This highest level of integration is undoubtedly the future direction of development, but at the current market time point, there is not much demand for this combination.
Wireless connection chip companies need to have seven core competencies
A company that provides wireless connectivity chips must survive in the future competitive landscape and must have the following core competencies:
Complete wireless connectivity technology IP (intellectual property). This is a prerequisite for developing a single-chip product.
Balanced wireless connectivity technology. Most companies that offer wireless connectivity are generally strong in individual areas and relatively weak in most other areas, which greatly limits the company's combined chip offering capabilities.
Mature product. Without extensive mass production testing, rushing to design and develop a single chip will increase the risk of the system.
Wafer-level SoC integration capabilities. The combination of wireless connectivity technologies is not a superposition of several single-chip functions in a simple sense, but rather involves the interworking of multiple wireless connectivity technologies. Module manufacturers can do SiP encapsulation of company A's Wi-Fi chip and company B's Bluetooth chip, but from the perspective of cost, integration, wireless technology's collaborative performance, power consumption and yield, the module product is definitely It is far less than a wafer-level SoC chip.
Leading semiconductor design process. At the current time point of view, the 65nm process design level is essential, which is very important for saving chip size and power consumption.
Grasping the market rhythm and the ability to lead the market. The launch of the combo chip at an inappropriate time will face the embarrassing situation of lack of market demand, making it difficult for the chip to be commercialized on a large scale, which makes it difficult for manufacturers to obtain a return on investment and develop a new round of products.
Grasp the key features of the product. The combo chip involves a number of key features of different connection technologies. The definition of demand is inaccurate, and a lot of research and development resources and market resources are wasted.
Baseband integrated wireless connection chip is not practical
GPS is integrated into the baseband chip. At present, only one company in the world has achieved this, but its GPS receiving performance is not as good as the independent GPS solution. We understand that most of the high-end GPS phones of Nokia, Samsung and Sony Ericsson use independent chips to realize GPS functions. And even if the GPS baseband is integrated into the cellular baseband, the handset requires a separate GPS RF module.
Bluetooth is integrated into the baseband chip. Today's Bluetooth chip size is very small, the price is very cheap, the integration is also very high, it is already a single chip. Some companies have integrated the Bluetooth baseband into the cellular baseband chip, but they also need a separate Bluetooth RF chip, which is not as good as a stand-alone Bluetooth SoC (system-on-a-chip). Moreover, a big application in the future is that the mobile phone is equipped with both Wi-Fi and Bluetooth, and it is necessary to solve the problem of coexistence interference between the two. Once Bluetooth is integrated into the baseband, coexistence interference with Wi-Fi is difficult to handle. The combination of Wi-Fi and Bluetooth is more in line with the law of industrial development and the real needs of the market. Moreover, the development of Bluetooth technology is extremely rapid, the protocol stack is becoming more and more abundant, and the version has been developed from 2.0 to 2.1, and then to 3.0. Therefore, the firmware of the Bluetooth chip needs to be continuously upgraded to meet the evolving market demand, which is closely related to the generation of baseband chips. The two- to three-year-old mature and stable development rhythm obviously does not match.
Wi-Fi is integrated into the baseband chip. Wi-Fi requires a certain amount of on-chip RAM (random access memory) and ROM (read only memory) resources due to its high operating rate (10 Mbps or more). A separate ARM CPU is required to implement its protocol function. MAC (Media Access Control) The hardware design of the layer must be in place. In addition, since the 802.11n standard has not yet been finalized, the protocol stack and firmware may need to be continuously upgraded. Wi-Fi has its own unique protocol and power-saving mode, and the RF working range is similar to that of 3G baseband chips. Therefore, if a manufacturer's Wi-Fi chip is unknowingly integrated into the baseband without large-scale commercial verification, the risk is relatively large. Therefore, only after the Wi-Fi market has developed relatively mature and stable, it is more rational for manufacturers to consider integration with cellular baseband.
Wireless connection chip integration solution to meet current market demand
Since mobile phone manufacturers need to provide different wireless connectivity functions for different market segments and user needs, multiple independent wireless connection chips + wireless connection Combo (combination) chips are the best solution to meet this real market demand and have sufficient flexibility. . In general, there are the following wireless connection chip working scenarios:
Independent Bluetooth chip. The independent Bluetooth chip is suitable for most of the low-end FeaturePhone (function phone) market today. The development trend of this type of Bluetooth chip is that the price is constantly lower and the function is getting stronger.
Independent GPS chip. The independent GPS chip is suitable for high-end smartphones with GPS positioning.
Independent FM chip. Since the price of FM chips has dropped very sharply, and Bluetooth and FM have almost become standard, this market is difficult to survive independently. At present, independent FM chips have to give way to Bluetooth+FM chips.
Independent Wi-Fi chip. Independent Wi-Fi is suitable for users who only need Wi-Fi application scenarios, but today Bluetooth is almost standard on mobile phones. Once Wi-Fi is needed, it is difficult to avoid Wi-Fi/Bluetooth combination chips. Independent Wi-Fi is suitable for special applications such as printers, digital photo frames, etc.
Bluetooth + FM combination chip. The combined chip application is more popular.
Bluetooth + Wi-Fi (+FM) combination chip. In applications where Wi-Fi is required, Bluetooth is almost the standard, so Bluetooth + Wi-Fi (+FM) is the best choice. Due to the relatively low price and technical threshold of FM, integrated FM is also a good choice. After all, the impact on cost and chip size is very important because it works in 2.4GHz ISM (industrial, scientific, medical frequency band). The problem is to solve the coexistence interference between Wi-Fi and Bluetooth.
Bluetooth + GPS + (FM) combination chip. The market is gradually heating up.
Broadcom currently offers corresponding products in all of the above categories.
Bluetooth + Wi-Fi + GPS (+ FM) combination chip. This highest level of integration is undoubtedly the future direction of development, but at the current market time point, there is not much demand for this combination.
Wireless connection chip companies need to have seven core competencies
A company that provides wireless connectivity chips must survive in the future competitive landscape and must have the following core competencies:
Complete wireless connectivity technology IP (intellectual property). This is a prerequisite for developing a single-chip product.
Balanced wireless connectivity technology. Most companies that offer wireless connectivity are generally strong in individual areas and relatively weak in most other areas, which greatly limits the company's combined chip offering capabilities.
Mature product. Without extensive mass production testing, rushing to design and develop a single chip will increase the risk of the system.
Wafer-level SoC integration capabilities. The combination of wireless connectivity technologies is not a superposition of several single-chip functions in a simple sense, but rather involves the interworking of multiple wireless connectivity technologies. Module manufacturers can do SiP encapsulation of company A's Wi-Fi chip and company B's Bluetooth chip, but from the perspective of cost, integration, wireless technology's collaborative performance, power consumption and yield, the module product is definitely It is far less than a wafer-level SoC chip.
Leading semiconductor design process. At the current time point of view, the 65nm process design level is essential, which is very important for saving chip size and power consumption.
Grasping the market rhythm and the ability to lead the market. The launch of the combo chip at an inappropriate time will face the embarrassing situation of lack of market demand, making it difficult for the chip to be commercialized on a large scale, which makes it difficult for manufacturers to obtain a return on investment and develop a new round of products.
Grasp the key features of the product. The combo chip involves a number of key features of different connection technologies. The definition of demand is inaccurate, and a lot of research and development resources and market resources are wasted.
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