The COB package is called the Chips on Board (COB), which is a technology to solve the problem of LED heat dissipation. Compared with in-line and SMD, it features space saving, simplified packaging, and efficient thermal management.
The COB package, that is, the chip on board, is to adhere the bare chip to the interconnect substrate with conductive or non-conductive glue, and then perform wire bonding to realize electrical connection. If the bare chip is directly exposed to the air, it is susceptible to contamination or man-made damage, affecting or destroying the function of the chip, so the chip and the bonding wire are encapsulated by glue. This package is also referred to as a soft encapsulation.
The COB package is the chip on board, which is to adhere the bare chip to the interconnect substrate with conductive or non-conductive glue, and then wire bonding to achieve electrical connection.
If the bare chip is directly exposed to the air, it is susceptible to contamination or man-made damage, affecting or destroying the function of the chip, so the chip and the bonding wire are encapsulated by glue. This package is also referred to as a soft encapsulation.
Analysis of Causes of LED Failure in COB PackageAlthough the theoretical life of LED chips can reach 100,000H from the technical point of view, due to the influence of packaging, driving, heat dissipation and other technologies, the life of light sources or lamps applied to general lighting can only reach 30000H, and even there are many used in the market for less than half a year. A product that will go wrong. How to improve the reliability of LED lighting products has always been a problem that enterprises need to solve.
LED lighting product failure modes can generally be divided into: chip failure, package failure, electrical stress failure, thermal stress failure, assembly failure. By analyzing and improving these failure phenomena, we can help design and produce high reliability LED lighting products.
COB-based LED product featuresLED lighting products consist of three main components, namely the heat sink structure, the drive power and the lighting. The illumination section consists of a light source and secondary optical light distribution components such as lenses, mirrors, and diffusers. A typical application model is shown in Figure 1. As a part of the light source in the LED lighting product, it is the core component and is the basic device for realizing the photoelectric performance. The COB-based technology is a kind of package form of the light source, which does not need any automatic surface mount process itself. It only needs to simply lead the lead and the negative electrode to be assembled into the base body or the lighting fixture. Figure 1 shows its key components in LED lighting products. These components are, in particular, COBs, in most cases, are assembled by hand. This results in more potential failures in the production process than in an automated process.
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