TSLC Taiwan Semiconductor Lighting will participate in the Radtech seminar on behalf of Taiwan UV UV LED from May 12 to May 14 from Hsinchu.
TSLC recently released a series of complete UV LED components, UV wavelength range from 365nm to 420nm, can be applied to nail lamps, anti-counterfeit pen equipment, rubber curing (Curing), printing equipment, PCB exposure applications, TSLC Research and development breakthroughs are almost leading the application of the UV LED industry.
TSLC's UV LED component product development capabilities exceed the size limit, from 3.5mm x 3.5mm (3W), 5.5mm x 5.5mm (10W) to the largest 9mm x 9mm (24W), and to match The actual application requirements, the development of different Lens angle products, from a small angle of 55 degrees, 65 degrees to a large angle of 110 degrees to 140 degrees have related products, customers can choose the right product according to their equipment needs
TSLC is good at controlling the heat dissipation requirements of UV LED components. Taiwan's exclusive aluminum nitride (AIN) substrate packaging technology can effectively transfer the thermal energy of the chip to the lower substrate, which is especially important for large wattage UV LED components, like 7070. And the 9090 series of high wattage multi-chip package products have excellent heat dissipation characteristics.
The company's latest UV LED 7070 series can be used for 365nm UV LED applications, and with the latest Quartz glass lens, it can reduce the loss of UV light and increase the uniformity of light output. I believe TSLC can represent Taiwan, rushing to the Radtech North American market, shines in the field of UV LED packaging.
TSLC recently released a series of complete UV LED components, UV wavelength range from 365nm to 420nm, can be applied to nail lamps, anti-counterfeit pen equipment, rubber curing (Curing), printing equipment, PCB exposure applications, TSLC Research and development breakthroughs are almost leading the application of the UV LED industry.
TSLC's UV LED component product development capabilities exceed the size limit, from 3.5mm x 3.5mm (3W), 5.5mm x 5.5mm (10W) to the largest 9mm x 9mm (24W), and to match The actual application requirements, the development of different Lens angle products, from a small angle of 55 degrees, 65 degrees to a large angle of 110 degrees to 140 degrees have related products, customers can choose the right product according to their equipment needs
TSLC is good at controlling the heat dissipation requirements of UV LED components. Taiwan's exclusive aluminum nitride (AIN) substrate packaging technology can effectively transfer the thermal energy of the chip to the lower substrate, which is especially important for large wattage UV LED components, like 7070. And the 9090 series of high wattage multi-chip package products have excellent heat dissipation characteristics.
The company's latest UV LED 7070 series can be used for 365nm UV LED applications, and with the latest Quartz glass lens, it can reduce the loss of UV light and increase the uniformity of light output. I believe TSLC can represent Taiwan, rushing to the Radtech North American market, shines in the field of UV LED packaging.
(This article is a TSLC contribution)
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