The method of heat dissipation of electronic components, natural heat dissipation and forced heat dissipation Natural heat dissipation refers to the purpose of achieving heat dissipation of local heating devices to the surrounding environment to achieve the purpose of controlling the temperature of electronic components without resorting to external energy or measures. The heat dissipation method has relatively low requirements for electronic components. Natural heat dissipation is usually suitable for electronic components with low temperature control requirements or low power components with low heat density emitted by electronic components, and does not need to be used. Some cooling technologies can achieve the purpose of heat dissipation of sealed components. In order to improve the heat dissipation capacity of electronic component systems, when the heat dissipation capacity is not high, usually combined with the characteristics of electronic components to strengthen electronic components Structural design enhances natural convection effects.
Forced heat dissipation is mainly to use the fan and other tools to force the air around the electronic components to take away the heat flow around the components. The heat dissipation method for forced heat dissipation is mainly suitable for air in the space between multiple components in the component. Flow, is a simple and convenient operation, but the heat dissipation method with obvious heat dissipation effect, and this forced convection heat dissipation method can be continuously improved by means, such as increasing the surface area of ​​the heat sink of the electronic component radiator To enhance the heat dissipation capacity of electronic components, it is also possible to add elements of micro channels that can forcibly reduce the heat resistance of the heat sink on the basis of the heat sink, thereby improving the heat dissipation effect of the heat sink. The purpose of heat dissipation through refrigeration is to provide a high-temperature heat source with a continuous low-temperature heat source to achieve temperature control. Most electronic components use Peltier refrigeration and refrigerant phase change refrigeration.
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