CEVA Corporation (NASDAQ: CEVA), the world's leading authorized provider of cellular communication, multimedia and wireless connectivity DSP IP platforms, announced that China's advanced wireless application integrated circuit (IC) supplier Beken CorporaTIon has obtained CEVA-TeakLite-4 DSP and RivieraWaves Sense 802.11n Wi-Fi platform license for the development of highly integrated wireless audio system-on-chip (SoC). This latest agreement is based on the successful deployment of CEVA's Bluetooth IP in a large number of wireless audio SoCs by Beken.
Broadcom's wireless audio SoC development roadmap will use the powerful processing power and ultra-low power consumption of CEVA-TeakLite-4 DSP to combine Wi-Fi, Bluetooth and audio functions in a single core, significantly reducing the cost of its future wireless audio SoC and System complexity.
Dawei Guo, vice president of engineering technology at Beken, said: "We are very pleased to further expand our strategic partnership with CEVA by adding CEVA-TeakLite-4 DSP and Wi-Fi IP to our wireless audio product roadmap. CEVA ’s "One-stop" wireless audio solutions are extremely attractive, allowing us to efficiently and easily bring cost-effective wireless audio SoCs to the market. "
Aviv Malinovitch, Vice President of CEVA and General Manager of the Connected Business Unit, said: "We have signed a comprehensive licensing agreement with Beken, one of the fastest growing semiconductor companies in China. This is how innovative companies can use our extensive DSP and wireless Connect the IP product portfolio to provide a good example of competitive and differentiated products. We look forward to continuing to develop a partnership with Beken to meet its future wireless connectivity and DSP product requirements. "
CEVA's one-stop wireless audio solution combines comprehensive audio and voice software for Bluetooth and Wi-Fi and full PHY and MAC layer solutions to provide flexible and highly integrated platform products. CEVA-TeakLite-4 DSP can efficiently handle the most demanding audio, voice and wireless connection use cases, supporting Bluetooth Low Energy (Bluetooth Smart) and Dual Mode Bluetooth (Bluetooth Smart Ready), Wi-Fi 802.11a / b / g / n / ac, ultra-low power Always-on applications, and high-end audio / voice processing. For more information, please visit the company's website.
About Broadcom
Broadcom (Beken CorporaTIon) is a major supplier of wireless application ICs in China, using advanced RF-CMOS transceiver technology to develop highly integrated high-performance semiconductor products. Founded in February 2005, Broadcom (Beken) is headquartered in Zhangjiang Hi-Tech Industrial Park, Pudong New Area, Shanghai, China, and has customer support offices in Shenzhen, Taipei, and Hong Kong. For more information, please visit the company's website.
About CEVA
CEVA is a leading authorized manufacturer of cellular communications, multimedia and wireless connectivity technologies to semiconductor companies and OEM manufacturers in the mobile communications, consumer electronics, automotive and Internet of Things markets. Our DSP IP product line includes a variety of comprehensive platforms for multimode 2G / 3G / LTE / LTE-A baseband processing for terminals and base stations, computer vision and computational imaging processing for any camera-equipped device, and multi-oriented Advanced audio / speech processing and ultra-low power Always-on / sensing applications in the IoT market. In the field of connectivity, we provide the industry's most extensive IP covering Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 b / g / n / ac and even 4x4) and serial storage (SATA and SAS). CEVA's IP is used in one-third of the world's mobile phones from top mobile phone OEMs such as Samsung, Huawei, Xiaomi, Lenovo, HTC, LG, Coolpad, ZTE, Micromax and Meizu. To learn more about CEVA, please visit the company's website.
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