At present, the price of solar silicon wafers can be said to increase all the way upwards. With the silicon wafers located in the industrial capacity supply bottleneck and the production capacity is not as fast as that of the downstream solar cell factories, it has been in short supply and orders have exceeded. The availability of capacity.

China and the United States responded to the December request for solar silicon wafers. Currently, they are facing pressure from customers to reduce prices. However, they are still discussing with customers. It is certain that the December offer is difficult to go up. The more likely result is Flat or small downwards to appreciate the pressure on downstream customers and the effects of off-season.

The price of Q4 in this year is also quite stable. In November, the price has increased by 1%. The average ASP solar silicon wafer ASP is at 3.85-3.95 US dollars. Some temporary orders have been quoted at more than 4 US dollars. It is also expected to boost the performance of China and the United States in October and November.

However, in the face of the December issue of Taiwan customers, the price has been loosened. The market has spread that some of the first- and second-line battery manufacturers that have already opened the price are quoted at $1.35-1.38 per watt, compared to the November contract price average of the first-line factory. Looking at the price of 1.4-1.42 US dollars, the monthly decline is about 3%. For the customer solar cell factory price has been adjusted downwards, the upstream Zhongmei Jing also faces the customer demand for price reduction.

Zhongmei Jing said that after several months of price increase, the solar silicon wafers in December are indeed difficult to get up again, but in terms of the order side, it is still very hot, and there is no customer to cut the order, and the silicon crystal The circle is located in the industry chain with relatively bargaining power, and will still communicate with customers, expecting to stabilize the price.

As China-US crystal consolidated revenue has reached a record high for 14 consecutive months, but due to the increase in production capacity has reached the bottleneck, the recent record high revenue of China-US-Crystal consolidated revenue has narrowed, and the future revenue will remain high-end stable. New capacity will be added after February next year, and there will be a large revenue contribution.

In the first three quarters of the US and China, the EPS has reached 7.16 yuan. According to estimates, China and the United States will have the EPS for the first time to break through 10 yuan or more, and the EPS will reach 10.3 yuan.

Standard PCB

A Printed Circuit Board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. Components (e.g. capacitors, resistors or active devices) are generally soldered on the PCB. Advanced PCBs may contain components embedded in the substrate.

PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Conductors on different layers are connected with vias. Multi-layer PCBs allow for much higher component density.

FR-4 glass epoxy is the primary insulating substrate. A basic building block of the PCB is an FR-4 panel with a thin layer of copper foil laminated to one or both sides. In multi-layer boards multiple layers of material are laminated together.

Printed Circuit Boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part.

Here at BentePCB, Standard PCB means manufacture parameter in General requirements, no special features.

Parameter Definition of Standard PCB as below:

Items	Manufacturing Capabilities
Number of Layers	1-16 layers
Material	FR-4
Maximum PCB Size(Dimension)	650x1200 mm
Board Size Tolerance(Outline)	Â±0.2mm/Â±0.5mm
Board Thickness	0.8-1.6mm
Board Thickness Tolerance(tâ‰¥1.0mm)	Â±10%
Board Thickness Tolerance(t<1.0mm)	Â±0.1mm
Min Trace	0.1mm/4mil
Min Spacing	0.1mm/4mil
Copper Thickness	1oz(35Î¼m)
Drill Sizes (CNC)	0.3-6.3mm
Min Width of Annular Ring	0.15mm(6mil)
Finished Hole Diameter (CNC)	0.3mm-6.2mm
Finished Hole Size Tolerance(CNC)	Â±0.08mm
Solder Mask	LPI
Minimum Character Width(Legend)	0.15mm
Minimum Character Height (Legend)	0.8mm
Character Width to Height Ratio (Legend)	1:05
Minimum Diameter of Plated Half Holes	0.6mm
Surface Finishing	HASL with lead
Solder Mask	HASL lead free
	Immersion gold
	Green ,Red, Yellow, Blue, White ,Black
Silkscreen	White, Black, None
Panelization	V-scoring,
	Tab-routing,
	Tab-routing with Perforation (Stamp Holes)

About Us:

BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB , rigid PCB and Flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volume.

Why Us?

UL (E492586), ISO9001, ISO14001, TS16949, RoHS certified.
Turnover USD 10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 16 layers.
Special Material:ROGERS, Arlon, Taconic.etc.
Client:Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.