The most professional and meticulous disassembly is undoubtedly the iPhone X Depth Map!
Since it's the 10th anniversary of the iPhone, I decided to take a photo with the original model. Thanks to Steve Jobs for changing the world forever.
Under X-ray, you can see two batteries (a first in iPhone history), an ultra-small circuit board, and a wireless charging ring. To make space for the front camera and sensors, the speaker has been slightly moved downward.
There’s also a mysterious chip between the Tapic Engine and the bottom speaker (marked in green). What could it be?
The two screws at the bottom are different from previous models.
The teardown process is still the same — start by heating up the device.
Then separate the screen from the body.
I saw the inner world, but I had to be careful with the cables.
This small card is the upper barrier — a key component that keeps the design moving forward.
Ok, the front panel is separated.
Under X-ray, remember the mysterious chip I mentioned earlier? It was attached to the screen. What is it exactly?
Two batteries take up most of the internal space.
The dual camera module is now removed.
This is the motherboard — is it too small?
The layout of the motherboard looks extremely dense, showcasing impressive design capabilities.
The two layers of the motherboard are tightly welded together and require a BGA heat gun to separate.
Three main boards are separated, each varying in size. Compared to the iPhone 8 Plus, the total area increased by 35%, but the double-layer stack significantly reduces the space used.
Let’s look at the first board:
Red: Apple APL1W72 A11 Bionic processor (top covered with SK hynix H9HKNNNDBMAUUR 3GB LPDDR4X memory)
Orange: Apple 338S00341-B1
Yellow: Texas Instruments 78AVZ81
Green: NXP 1612A1
Cyan: Apple 338S00248 audio encoder
Blue: STB600B0
Purple: Apple 338S00306 Power Management IC
Now looking at the second board:
Red: Apple USI 170821 339S00397 Wi-Fi/Bluetooth Wireless Module
Orange: Qualcomm WTR5975 Gigabit LTE Transceiver
Yellow: Qualcomm MDM9655 Snapdragon X16 LTE baseband, PMD9655 power management IC
Green: Skyworks 78140-22/SKY77366-17 power amplifier, S770 6662, 3760 5418 1736
Cyan: Broadcom BCM15951 touch controller
Blue: NXP 80V18 PN80V NFC Controller
Purple: Broadcom AFEM-8072, MMMB power amplifier
Next is the last small board:
Red: Toshiba TSB3234X68354TWNA1 64GB flash memory
Orange: Apple/Cirrus Logic 338S00296 Audio Amplifier
Between multiple boards, Apple doesn’t use traditional cables — instead, they use a series of perforations.
Under X-ray, the stereo structure of the SoC and surrounding circuitry becomes more visible, especially the peripheral perforations.
Looking at the side view under X-ray, can you see the perforation?
Alright, next is the battery.
Although it’s split into two parts, it’s actually one unit.
Battery specs: 10.35W, 2716mAh, 3.81V — slightly higher than the iPhone 8 (10.28Wh) and even more than the Galaxy Note 8 (12.71Wh).
The TrueDepth camera system is definitely a highlight of the iPhone X, as it enables Face ID facial recognition.
The red frame is the front camera, the orange frame is the infrared dot matrix projector, and the yellow frame is the infrared camera.
Under X-ray.
Removing the Tapic Engine.
Bottom speakers and waterproof glue.
Waterproof components — “pseudo horn.â€
Lightning interface.
Going back to the front panel, the first thing is the earpiece speaker, which has been redesigned.
This should be the most complex front panel: speakers, microphones, ambient light sensors, floodlight sensing elements, and distance sensors.
After removing all components, the screen is finally taken off.
It’s time for the wireless charging ring.
It connects to the volume button, mute switch, and an unknown sensor.
The flash and power button are here.
Returning to the back of the device, the glass backshell — unlike the iPhone 8 Plus, which broke during removal, this time everything went smoothly.
Also, the camera cover needs to be removed.
Smooth separation — no accidents this time.
Finally, a full collection of all parts.
Since it's the 10th anniversary of the iPhone, I decided to take a photo with the original model. Thanks to Steve Jobs for changing the world forever.
Under X-ray, you can see two batteries (a first in iPhone history), an ultra-small circuit board, and a wireless charging ring. To make space for the front camera and sensors, the speaker has been slightly moved downward.
There’s also a mysterious chip between the Tapic Engine and the bottom speaker (marked in green). What could it be?
The two screws at the bottom are different from previous models.
The teardown process is still the same — start by heating up the device.
Then separate the screen from the body.
I saw the inner world, but I had to be careful with the cables.
This small card is the upper barrier — a key component that keeps the design moving forward.
Ok, the front panel is separated.
Under X-ray, remember the mysterious chip I mentioned earlier? It was attached to the screen. What is it exactly?
Two batteries take up most of the internal space.
The dual camera module is now removed.
This is the motherboard — is it too small?
The layout of the motherboard looks extremely dense, showcasing impressive design capabilities.
The two layers of the motherboard are tightly welded together and require a BGA heat gun to separate.
Three main boards are separated, each varying in size. Compared to the iPhone 8 Plus, the total area increased by 35%, but the double-layer stack significantly reduces the space used.
Let’s look at the first board:
Red: Apple APL1W72 A11 Bionic processor (top covered with SK hynix H9HKNNNDBMAUUR 3GB LPDDR4X memory)
Orange: Apple 338S00341-B1
Yellow: Texas Instruments 78AVZ81
Green: NXP 1612A1
Cyan: Apple 338S00248 audio encoder
Blue: STB600B0
Purple: Apple 338S00306 Power Management IC
Now looking at the second board:
Red: Apple USI 170821 339S00397 Wi-Fi/Bluetooth Wireless Module
Orange: Qualcomm WTR5975 Gigabit LTE Transceiver
Yellow: Qualcomm MDM9655 Snapdragon X16 LTE baseband, PMD9655 power management IC
Green: Skyworks 78140-22/SKY77366-17 power amplifier, S770 6662, 3760 5418 1736
Cyan: Broadcom BCM15951 touch controller
Blue: NXP 80V18 PN80V NFC Controller
Purple: Broadcom AFEM-8072, MMMB power amplifier
Next is the last small board:
Red: Toshiba TSB3234X68354TWNA1 64GB flash memory
Orange: Apple/Cirrus Logic 338S00296 Audio Amplifier
Between multiple boards, Apple doesn’t use traditional cables — instead, they use a series of perforations.
Under X-ray, the stereo structure of the SoC and surrounding circuitry becomes more visible, especially the peripheral perforations.
Looking at the side view under X-ray, can you see the perforation?
Alright, next is the battery.
Although it’s split into two parts, it’s actually one unit.
Battery specs: 10.35W, 2716mAh, 3.81V — slightly higher than the iPhone 8 (10.28Wh) and even more than the Galaxy Note 8 (12.71Wh).
The TrueDepth camera system is definitely a highlight of the iPhone X, as it enables Face ID facial recognition.
The red frame is the front camera, the orange frame is the infrared dot matrix projector, and the yellow frame is the infrared camera.
Under X-ray.
Removing the Tapic Engine.
Bottom speakers and waterproof glue.
Waterproof components — “pseudo horn.â€
Lightning interface.
Going back to the front panel, the first thing is the earpiece speaker, which has been redesigned.
This should be the most complex front panel: speakers, microphones, ambient light sensors, floodlight sensing elements, and distance sensors.
After removing all components, the screen is finally taken off.
It’s time for the wireless charging ring.
It connects to the volume button, mute switch, and an unknown sensor.
The flash and power button are here.
Returning to the back of the device, the glass backshell — unlike the iPhone 8 Plus, which broke during removal, this time everything went smoothly.
Also, the camera cover needs to be removed.
Smooth separation — no accidents this time.
Finally, a full collection of all parts.Low Smoke Halogen Free Material Cable
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